wafer bonding meaning in Chinese
晶片键合
晶片接合
晶圆键合
Examples
- To achieve the required bump heights , the solder paste is over - printed onto the wafer bond pads
为了获得要求的凸起高度，锡膏在晶片焊盘过焊。 - An equipment for vacuum wafer bonding was developed based on the wafer bonding technology
摘要基于圆片键合技术，设计了一种在真空条件下进行圆片键合的工艺设备。 - Abstract : this paper introduces the technology of solid membrane transfer by wafer bonding and its applications
文摘:阐述了利用键合方法转移薄膜材料的技术及其应用。 - Our analysis shows that the criterion for self - propagating wafer bonding is relevant to the dimensionless parameter
分析结果表明，晶片直接键合的条件与无量纲参数有关。 - Over coming lattice and orientation mismatch , direct wafer bonding allows fabricating of structures and devices which can ? get through hetero - epitaxial growth
利用键合技术可以集成晶格或晶向失配的材料，制造传统外延生长技术不能制造的结构和器件。